Failure analysis of semiconductors and components is essential to identifying and improving the cause of failure during product development and mass production. We provide optimal analysis solution through various failure analysis methods.
▶ Inquiry/Request for Analysis : sjlee@techline.co.kr
Destructive Analysis
Decap and Delayer by Chemical
Decap and Delayer by Laser
Decap and Delayer by Parallel Lapping
Chemical Decap and Laser Decap
OM Image after Delayer
SEM Image after Delayer
Non-Destructive Analysis
X-Ray
Scanning Acoustic Through (SAT)
Optical Profiler (OP)
3D X-Ray Microscopy
High-Resolution 3D Optical Microscopy
Time Domain Reflectometry (TDR)
X-Ray (2D and Tilt)
Optical microscopy (OM)
SAT Anylysis
Optical profiler (OP)
3D X-ray microscopy ; Cu Wire
3D X-ray microscopy ; Al Wire
3D X-ray microscopy ; (a)PCB substrat (b) TSV void
3D X-ray microscopy ; (a)Mini motor (b) Wire lifting
High-resolution 3D optical microscopy ; Wire Bonding and Gold Bump
High-resolution 3D optical microscopy ; WLCSP
Electrical Analysis
- Emission Microscopy (EMMI)
- InGaAs
- Optical Beam Induced Resistance Change (OBIRCH)
- Conductive Atomic Force Microscopy & Electric Field Microscopy
- Thermal Emission Microscopy
- Nano Probing
Emission microscopy (EMMI)
InGaAs
Optical Beam Induced Resistance Change (OBIRCH)
Thermal emission analysis image through IC’s front side