Packaging and Test
We have agency partnerships with overseas OSATs, and provide turnkey services from packaging to testing for semiconductor parts manufacturing.
And we provide MPW and ES sample assembly services needed early in the development of semiconductor products with reasonable price and rapid response.
• Package Assembly • Wafer Test and Final Test • MPW and ES Assembly

Analysis
By partnering with overseas professional analysis companies who are certified by global authorized organizations, we provide various analysis services for semiconductor, industrial, and consumer products, contributing to the development and mass production of high-quality products.
We offer a variety of analysis services at a reasonable price that is more competitive than others.
• ESD Test • Reliability Test • FIB Analysis and Circuit Modification • Failure Analysis • Benchmark (Reverse Engineering) • Physicochemical Characterizations • Material Analysis (Structure Analysis) • Surface Analysis (Component Analysis) • Warpage Analysis

Open Cavity Package
We offer a wide variety of Open Cavity Package assembly services, which can dramatically reduce package sample assembly time and design verification time.



