• Tekline Korea Co., Ltd.

  • A-813, 184, Jungbu-daero, Giheung-gu, Yongin-si, Gyeonggi-do, Korea
  • TEL : +827077785814
  • EMAIL : tskim@tekline.co.kr
  • COPYRIGHT©
    Tekline Korea Co., Ltd.
    All RIGHTS RESERVED.

Packaging and Test

Packaging and Test

Package Assembly

  • We offer various kinds of packages for mass production.
  • We provide assembly service for MPW and Engineering Sample using mass production packages.
PKG Type Body Size Pin Count Photo
TO TO-92 3/4L
TO-92
TO-220
TO-251
TO-252
TO-220 3L
TO-251 3L
TO-252 3/5L
SOT SOT-23 3/5/6/8L
SOT-23
TSOT-23
SOT-89
SOT-223
TSOT-23 3/5/6/8L
SOT-89 3L
SOT-223 3L
P-DIP 300mil 7~20L
P-DIP
P-DPI
600mil 24~48L
Skinny 22~28L
Shrink 24~42L
SOP 150~450mil 7~32L
SOP
SSOP
TSOP
SSOP 150~300mil 16~6L
TSOP 8x18.4~12x18.4mm 32~48L
TSSOP 173~240mil 8~64L
MSOP 118mil 8/10L
SOJ 300~400mil 20~44L
PLCC 11.43x13.97
~16.54x16.54mm
32~44L
PLCC
QFP 10x10 ~ 28x28mm 44~208L
QFP
LQFP
LQFP 7x7 ~ 28x28mm 32~256L
TQFP 7x7 ~ 14x14mm 32~128L
QFN 1.6x1.6 ~ 12x12mm 12~100L
QFN
DFN
Ultra Slim QFN/DFN
DFN 1.0x1.0 ~ 6x8mm 4~14L
Ultra Slim QFN/DFN (0.35mm) 1.1x0.7 ~ 1.6x1.6mm 6~18L
Wettable Flank QFN Available for all QFN and DFN 12~100L
Wettagble Flank QFN
PKG Type PKG Application Photo
DR-QFN Available to expand pin count of QFN
DR-QFN
FlipChip FC-QFN, FC-BGA,
FC-LGA,
FC-TSOT
FlipChip
BGA LFBGA, TBGA, TFBGA, VFBGA, WFBGA, UFBGA
BGA
LGA LGA, FlipClip LGA,
SiP-LGA
LGA
SiP SiP in LeadFrame, SiP in BGA,
SiP in LGA
SiP
WLCSP 200/300mm Wafer,
Bumping, RDL, Back-End
WLCSP
Bumping FlipChip CSP, FlipChip BGA,
QFN, DFN
Cu/ni/Au and Cu RDL

Cu/Ni/Au and Cu RDL

Cu Pillar Bump Cu Pillar Bump

Cu Pillar Bump

Lead Free Bump

Lead Free Bump

MCP 4Die Stack + @, FOW,
WireBond + FlipChip
MCP
MIS FlipChip MIS, WireBond MIS
MIS
MIS
FanOut-WLP M-Series FO-WLP
FanOut-WLP