We provide various kinds of Open Cavity Package assembly services such as SOP, QFN, and QFP.
Through the Open Cavity Pakage, you can reduce the package sample assembly time dramatically(approximately 1 week) and so shorten the chip design verification periods significantly.
Open Cavity Package can be applied in a variety of areas, for example fabless, chip design companies, research institutes, universities and etc.
SOP
Type | Lead count | Body size | Lead pitch (Lead width) |
Paddle size | |
---|---|---|---|---|---|
SOP SOP-EP * EP : Exposed Pad |
|
8 | 150mil | 1.27mm(0.4) | 2.5mm × 1.9mm |
8 (EP) | 150mil | 2.5mm × 1.9mm | |||
16 | 150mil | 3.0mm × 1.9mm | |||
16 (EP) | 150mil | 3.0mm × 1.9mm | |||
20 | 300mil | 5.5mm × 3.8mm | |||
20 (EP) | 300mil | 5.5mm × 3.8mm | |||
24 | 300mil | 5.5mm × 3.8mm | |||
24 (EP) | 300mil | 5.5mm × 3.8mm | |||
28 | 300mil | 5.8mm × 4.0mm | |||
28 (EP) | 300mil | 5.8mm × 4.0mm |
QFN
Type | Lead count | Body size | Lead pitch (Lead width) |
Paddle size | |
---|---|---|---|---|---|
QFN |
|
16 | 3mm × 3mm | 0.5mm(0.23) | 1.4mm × 1.4mm |
20 | 4mm × 4mm | 0.5mm(0.3) | 3.4mm × 3.4mm | ||
20 | 5mm × 5mm | 0.65mm(0.3) | 3.4mm × 3.4mm | ||
24 | 4mm × 4mm | 0.5mm(0.23) | 3.6mm × 3.6mm | ||
32 | 5mm × 5mm | 0.5mm(0.23) | 3.4mm × 3.4mm | ||
40 | 6mm × 6mm | 0.5mm(0.25) | 4.3mm × 4.3mm | ||
48 | 6mm × 6mm | 0.4mm(0.2) | 4.3mm × 4.3mm | ||
48 | 7mm × 7mm | 0.5mm(0.23) | 5.3mm × 5.3mm | ||
64 | 9mm × 9mm | 0.5mm(0.25) | 7.1mm × 7.1mm | ||
100 | 12mm × 12mm | 0.4mm(0.2) | 9.3mm × 9.3mm |
PLCC/LQFP/Ceramic
Type | Lead count | Body size | Lead pitch (Lead width) |
Paddle size | |
---|---|---|---|---|---|
PLCC |
|
80 | 12mm × 12mm | 0.5mm(0.25) | 8mm × 8mm |
120 | 20mm × 20mm | 0.6mm(0.33) | 8mm × 8mm | ||
LQFP | 44 | 10mm × 10mm | 0.8mm(0.44) | 6.8mm × 6.8mm | |
64 | 10mm × 10mm | 0.5mm(0.2) | 6.8mm × 6.8mm | ||
C-LCC | 48 | 14.22mm × 14.22mm | 1.0mm(0.5) | 10mm × 10mm | |
C-DIP | 28 | 35.56mm × 15.5mm | 2.54mm | 7.8mm × 7.8mm | |
C-PGA | 100/144/208 | Customised |