Reliability is the ability of the product to perform certain functions under standard environmental conditions for a certain period of time, measured with the probability of failure and maintainability of the product.

▶ Inquiry/Request for Analysis : cs@techline.co.kr

In accordance with MIL-STD, JEDEC, IEC, JESD, AEC and EIA specifications, various reliability testing services based on various reliability testing standards are available based on expected/real-world technical specifications for the product and customer's requirements.

Component Level Reliability Test

High Temperature Operating Life test (HTOL)：MCC HPB-5C/ LC2/ LC1/KYEC HP-600/KYE 680/SSE B1120M
High Temperature Storage test (HTST)：ESPEC PV-231M
Low Temperature Storage test (LTST)：ESPEC :SML-2/PSL-2KP
Temperature & Humidity Storage test (THST)：ESPEC :SML-2/PSL-2KP
Temperature & Humidity with bias test (THB)：ESPEC :SML-2/PSL-2KP
Pressure Cooker test (PCT/UB-HAST)：ESPEC TM/EHS-221MD
Highly Accelerated Temperature & Humidity Stress test (HAST)：ESPEC TPV-432ZM/EHS-221MD
Temperature Cycling test  (TCT)：ESPEC TCC-150/EGNX28/EGNZ28
Thermal Shock test (TST)：ESPEC TSA-71H (air to air)
Thermal Shock test (TST)：ESPEC TSB-51 (liquid to liquid)
Bias Life test (BLT)：ESPEC PV-231M
Reflow Test： TANGTECK SMD-10-M16HAO

(a)MCC HPB-5C  (b)MCC LC2  (c)MCC LC1  (d)KYE HP-600  (e)KYE-680  (f)SSE-1120M  

(g)ESPEC TSA-71H  (h)ESPEC TSB-51  (i)ESPEC EHS 221MD  (j)ESPEC PV-231M  (k)ESPEC PL-4KP  (l)SMD-10-M16HAO

Board Level & System Level Reliability Test

Board Level Drop Test : Lansmont P30
Board Level Temperature cycle Test : ESPEC TCC 150, ESPEC AMR
Board Level Monotonic Bend Test : Instron 5967
Board Level Cyclic Bend Test : Instron 5967
Strain Measurement : Kyowa PCD400A
Surface Mounting Technology：Printer (Hitachi)/SPI(TR7007M SII Plus)/Mounter(JUKI)/Reflow(SONIC)
Vibration Test：IMV i240/SA3M

 (a)ESPEC TCC-150 & Data Logger  (b)Lansmont P30  (c)IMV i240/SA3M  (d)KYPWA PCD400

(a)HITACHI  (b)TR7007M SII Plus  (c)JUKI  (d)SONIC